Suitable for use in membrane switches and steel dome contact applications. Go to product viewer dialog for this item. IPC-4556 - Amendment 1
High pull strengths for gold, aluminum, and even copper wire bonding.
This critical update added a maximum gold thickness of 0.070 µm. This limit prevents "hyper-corrosion" of the nickel, which can occur if the gold plating process is too aggressive or prolonged. ipc4556 pdf
IPC-4556 specifies X-ray Fluorescence (XRF) as the primary method for verifying thickness. It mandates the use of Solid State Detectors (SSD) for better resolution on tri-level coatings and requires calibration against national standards.
A major advantage of following IPC-4556 is that it ensures the surface is compatible with diverse attachment technologies: Suitable for use in membrane switches and steel
is the primary industry standard defining requirements for Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) plating on printed circuit boards (PCBs). Often called the "universal finish," ENEPIG is unique because it supports multiple assembly processes—including soldering and various types of wire bonding—on a single surface. Core Layer Requirements
IPC-4556 establishes precise thickness ranges for each of the three metal layers. These specifications are designed to balance reliability, solderability, and cost. Plating Layer Thickness Range (µm) Thickness Range (µin) Primary Function 3.0 – 6.0 118.1 – 236.2 Diffusion barrier and structural support Electroless Palladium 0.05 – 0.15 2.0 – 12.0 Protects nickel from corrosion; enables wire bonding Immersion Gold 0.030 – 0.070 1.2 – 2.8 Prevents oxidation; maintains solderability Key Provisions and Amendments This critical update added a maximum gold thickness of 0
Excellent wetting for both lead-free (SAC305) and leaded (Sn63Pb37) alloys.